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Posts Tagged ‘Infineon’

When will we see an LTE iPhone 4G?  2010 or sooner?

hero20080609iPhonAsia comment: LongTerm Evolution (LTE) 4G technology in a new iPhone could mean insanely fast speeds … as high as 150Mbps download and upload speeds as high as 50Mbps … about 100x more bandwidth (much faster) than most 3G networks.  LTE networks are not that far off … as soon as 2010 in Europe. China Mobile plans to have their own “indigenously innovated” TD-LTE 4G network by 2011. 

Infineon one-chip 4G radio may see iPhone

picture-211See full post > HERE
Infineon yesterday quietly introduced a new transceiver chip that may dictate the future of the iPhone and other handsets. The SMARTi LU is touted as the first single-chip radio to include the new Long Term Evolution (LTE) standard for 4G Internet access and does so through a smaller, 65 nanometer assembly process that keeps the design small. It also includes the advanced HSPA+ standard for 3G as well as legacy support for 2G-era EDGE data and GSM calling.infineonsmartilu

A baseband interface is also built-in, the company notes.

The advancement would let future smartphones and other portables download information as quickly as 150Mbps in ideal conditions and upload at 50Mbps, or roughly 100 times the bandwidth of most recent 3G connections. HSPA+ would also let devices on more near-term network upgrades connect at up to 21Mbps (potentially 42Mbps) without the significant changes that LTE requires.

Infineon doesn’t outline a release schedule but says it will already have samples and tests available at the Mobile World Congress show, which starts in February.

While its suitability is uncertain at this early stage, SMARTi LU potentially sets the groundwork for future iPhones. Since launch, the handset line has used Infineon transceivers. Although a recent rumor suggests Apple may switch to Broadcom, the latter has yet to introduce more than a basic HSPA radio and currently presents a limited upgrade path. Carriers in the US and abroad are expected to quickly adopt faster cellular data within the next two years, with HSPA+ launching on AT&T this year and LTE appearing on Bell, Telus, Verizon, Vodafone and other carriers in 2010.

lte

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Inside iPhone 3G… Tear down photo courtesy Semiconductor Insights. Another teardown image courtesy iFixit > HERE

Vijay Nagarajan pretty much nailed the new iPhone 3G chipset months ago.  See > HERE


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The Commercial Times, a Chinese-language newspaper, posted and article on June 19, 2008 claiming their sources have provided them with the skinny on what’s in iPhone 3G.  Per their reports, and translations from Digitimes, the following companies’ componentry will is inside iPhone 3G:

PART MAKER  
GPS Chips Broadcom (BRCM)  
Camera Lens Largan Precision and Genius Electronics  
Handset Chips Infineon (IFX)  
Foundry UMC  
Case Foxconn  
Crystal TXC, NTK  
PCP Nanya PCB, Unimicron  
Assembly Foxconn  
IC Package Siliconware Precision Industries  
Camera Altus Technology, Primax  
Panel Sharp (SHCAY.PK)  

The Commercial Times has reported various leaks for months. It’s all speculation until the iPhone 3G is opened-up … first chance comes July 11th.

See also > 3G iPhone predictions recap

 

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Update 6/03/08: See Vijay Nagarajan’s current post >Infineon, Marvell and the iPhone 

EXCERPT: Apple is expected to announce the 3G iPhone this month. Based on a reasonable set of assumptions, I have speculated that Infineon will continue to be at the heart of the iPhone. Clues that ratify this scenario have also been uncovered in the recent months. Recently, however, there were two industry events that made many question this theory. Here, I will take a look at these events and what they signify for the iPhone. Read the full article>>

 

Infineon enhances chipset in quest of iPhone (3.0?)

Infineon announced a chipset enhancement (a combination of the XMM 6180 app processor and an X-GOLD 618 baseband) that may prove to be ideal for the iPhone 3.0 (2009 or 2010). Recent rumors suggested that iPhone 2.0, likely to be unvelied soon, would receive a current Infineon chipset for the initial transition to 3G.

Infineon cautions that the newly designed XMM 6180 isn’t available today however it will soon be in test mode. Sampling of the hardware for testing by handset makers starts in June, with mass production not anticipated until the latter half of 2009.

Infineon

Details >HERE 

In related news …

5/30/08: Infineon warned the Street of lower than expected orders for an “unidentified project to supply chips for high-speed Internet phones.”  Could Infineon’s loss of business be from Samsung? … from Apple? … or?  Unknown. Many have presumed infineon’s loss of chip business is from Apple.  JMHO, but there is not enough info to know yet whether Infineon has lost iPhone 2.0. If Infineon misses on iPhone 2.0, the next best candidate might me Marvell

Marvell’s integrated chipset leaves room for big battery

5/30/08: An IBD article speculates that a Marvell chipset will run in next-gen iPhone (2.0).  NOTE: Marvell offers an integrated chipset (baseband and applications processor together) which leaves more room for an enlarged battery – battery life is very important to Apple. Read discussion thread > HERE

Marvell


 

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Vijay Nagarajan has posted an interesting article re 3G Phone and Apple’s possible licensing deals with component vendors – Infineon, InterDigital and in particular Qualcomm. 

See an excerpt from Vijay’s post below. Readers are encouraged to visit Wireless Industry Analyst where they can read the > full article.

 

EXCERPT: The 3G iPhone rumors are getting more frequent by the day. We all know it will hit the market. It is just a question of when. I have, in the past, looked at the likely component vendors for the impending iPhone including Infineon and InterDigital. As requested by one of our readers, we take a look at a company which will gain from the 3G iPhone, even without a single component inside it – Qualcomm.

With a substantial portion of the 3G intellectual property (IP), Qualcomm stands to make royalty money from every CDMA-based phone sold around the world. Three out of four phones in the 2010-2011 timeframe are expected to be CDMA-based. Quite obviously, this includes the impending 3G iPhone.

If a 3G iPhone is available in the next couple of months, I estimate …. (MORE) … For full article, please read > HERE


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Update 6/03/08: See Vijay Nagarajan’s current post >Infineon, Marvell and the iPhone 

EXCERPT: Apple is expected to announce the 3G iPhone this month. Based on a reasonable set of assumptions, I have speculated that Infineon will continue to be at the heart of the iPhone. Clues that ratify this scenario have also been uncovered in the recent months. Recently, however, there were two industry events that made many question this theory. Here, I will take a look at these events and what they signify for the iPhone. Read the full article>>

     

 

All that glitters may be Infineon’s S-GOLD3H 

Is the S-GOLD3H the 3G iPhone’s new processor? See evidence > HERE

Zibri (www.ziphone.org) has uncovered code for the Infineon chip in the latest iPhone 1.2 beta firmware

Summary of features and benefit from S-GOLD3H spec sheet 

Infineon’s S-GOLD3H is capable of processing speeds of up to 312 MHz with advanced dual-mode HSDPA/WCDMA/E-GPRS modem technology that enables a wide spectrum of multimedia and mobile entertainment and office applications.

S-GOLD3H based platforms enable handsets to provide:

·      Camera support of up to 5 MPixel

·      Video telephony, streaming, recording and playback

·      (HVGA) in MPEG4, H.264 or Real video formats and advanced audio codecs, like enhanced AAC+.

·      Optimized S-GOLD3H architecture allows users to run several applications simultaneously; e.g. surf the Internet, download emails or data to a SD-card with HSDPA category 8 (7.2 Mbit/s) while listening to MP3 music over a stereo Bluetooth headset.

 

For more background, see also Vijay Nagarajan’s recent articles on Apple and Infineon

http://sramanamitra.com/2007/12/28/interdigital-the-apple-deal/

http://sramanamitra.com/2007/12/27/interdigital-the-infineon-alliance/

http://wirelessanalyst.blogspot.com/2007/12/interdigital-series-part-3.html

 

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