The Commercial Times, a Chinese-language newspaper, posted and article on June 19, 2008 claiming their sources have provided them with the skinny on what’s in iPhone 3G. Per their reports, and translations from Digitimes, the following companies’ componentry will is inside iPhone 3G:
| PART | MAKER | |
| GPS Chips | Broadcom (BRCM) | |
| Camera Lens | Largan Precision and Genius Electronics | |
| Handset Chips | Infineon (IFX) | |
| Foundry | UMC | |
| Case | Foxconn | |
| Crystal | TXC, NTK | |
| PCP | Nanya PCB, Unimicron | |
| Assembly | Foxconn | |
| IC Package | Siliconware Precision Industries | |
| Camera | Altus Technology, Primax | |
| Panel | Sharp (SHCAY.PK) |
The Commercial Times has reported various leaks for months. It’s all speculation until the iPhone 3G is opened-up … first chance comes July 11th.
See also > 3G iPhone predictions recap
